High-End Performance Packaging Market Growth Factors, Opportunities, Ongoing Trends and Key Players (Computers - Information Technologies)
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High-End Performance Packaging Market Growth Factors, Opportunities, Ongoing Trends and Key Players | |
FMI estimates that the global market for high-end performance packaging will be worth $3.3 billion by 2022. From 2023 to 2033, the global demand for high-end performance packaging will grow at a 15.9% CAGR. By 2033, the market for high-end performance packaging is estimated to be worth $17.0 billion. Throughout the assessment phase, UHD FO technology will dominate the market. According to FMI, the UHD FO category will increase at a CAGR of 15.8%. The market for high-end performance packaging is being driven by the growing need for cutting-edge packaging technologies. Sales will increase until 2033 as a result of the ongoing trend toward miniaturization. Increasing adoption of high-performance computing (HPC) will propel high-end performance packaging demand. Further, rising popularity of autonomous vehicles will create growth prospects for the market. Different high-end performance packaging technologies are being used to design ultra-thin devices. These technologies include Ultra High-Density Fan Out (UHD FO), HBM, etc. The UHD FO packaging is used in advanced technologies such as 5G, cloud computing, and ADAS. High Bandwidth Memory (HBM) has application in bandwidths above 256 GBps. It reduces power consumption of the circuitry. Si Interposer finds application in heterogeneous packaging techniques. Foveros by Intel provides 3D stacking solutions that make packaging more efficient. It is designed to incorporate two or more chiplets assembled together. EMIB and Co-EMIB are used in the high-performance computing applications. They make the whole electronics circuit consume less power and function at a higher pace. Hence, growing usage of these high-end performance packaging technologies will boost the market. Key Takeaways from High-End Performance Packaging Market Report: The market for high-end performance packaging is set to reach a massive valuation of US$ 17.0 billion by 2033. Global high-end performance packaging demand is set to increase at 15.9% CAGR through 2033. By technology, UHD FO segment will expand at 15.8% CAGR during the forecast period. Based on application, high performance computing segment will accelerate at 15.7% CAGR. The United States high-end performance packaging market will exhibit a CAGR of 15.2%. Sales of high-end performance packaging across China will surge at 17.4% CAGR through 2033. Japan’s high-end performance packaging market will reach US$ 2.7 billion by 2033. “Surging applications in high-performance computing and autonomous vehicles will continue to boost the global high-end performance packaging market”, says a lead Future Market Insights analyst. Who is Winning? Leading players operating in the high-end performance packaging market are developing advanced packaging solutions to meet end user demand from several industries. Besides this, they are adopting strategies such as partnerships, collaborations, acquisitions, and mergers. Key high-end performance packaging companies include Intel, TSMC, ASE, Samsung, Amkor, JCET Group, Tongfu, ADI, AMD, and ARM. These leading high-end performance packaging manufacturers are developing advanced packaging solutions. For instance, In February 2022, Intel Corporation, the United States-based Technology Company announced that it has signed a definitive agreement in order to acquire the Tower Semiconductor. Get More Insights into High-End Performance Packaging Market Future Market Insights, in its new offering, presents an unbiased analysis of the High-End Performance Packaging market, presenting historical market data (2018 to 2022) and forecast statistics for the period of 2023 to 2033. The study reveals extensive growth in High-End Performance Packaging based on technology (UHD FO, HBM, 3DS, Foveros , 3DNAND, Co-EMIB, EMIB, Si interposer, 3D SoC) and application (data center networking, high-performance computing and autonomous vehicles) across several regions. Global High-End Performance Packaging Market Segmentation By Technology: UHD FO HBM 3DS Foveros 3DNAND Co-EMIB EMIB Si interposer 3D SOC By Application: Data Center Networking High Performance Computing Autonomous Vehicles By Region: North America Europe Asia Pacific Latin America Middle East & Africa | |
| Target State: All States Target City : All Cities Last Update : Sep 03, 2024 10:24 AM Number of Views: 49 | Item Owner : Sudip Saha is the managing director and co-founder at Future Market Insights Contact Email: (None) Contact Phone: (None) |
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2024-12-26 (0.385 sec)