FC CSP substrate (Computers - Hardware)

Item ID 133207775 in Category: Computers - Hardware

FC CSP substrate
A flip chip simply means that the chip is flipped over to make a connection with the substrate or lead frame. Flip chip does not depend on the wire bonding as a means of interconnection but it uses solder or bumps such as copper pillar. This means that the I/O pads can be placed at any section of the surface of the chip and therefore the chip size can be reduced with an appropriate circuitry path. This is attributed to the fact that the absence of a bonding wire contributes to the minimization of signal inductance. Contact Info:- High Quality PCB Co., Limited Office: Shajing Town, Baoan District, Shenzhen, Guangdong 518000, China Plant 1 address: Building 5-6, Fu Qiao 3rd Industrial Zone, Bao' an, Shenzhen, Guangdong, China Plant 2 address: Zhuhai, Guangdong, China Plant 3 address: Dongguan, Guangdong, China TEL: +86-755-23724206 WahtsApp: +86-189 2381 2997 Skype: shawnwang2006 Email: sales@efpcb.com

Target State: All States Target City : Shenzhen Last Update : Sep 30, 2024 7:07 AM Number of Views: 104	Item Owner : Shawn Wang Contact Email: Contact Phone: +86-755-23724206

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2024-10-31 (0.392 sec)