FC CSP substrate (Computers - Hardware)

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Item ID 133207775 in Category: Computers - Hardware

FC CSP substrate


A flip chip simply means that the chip is flipped over to make a connection with the substrate or lead frame. Flip chip does not depend on the wire bonding as a means of interconnection but it uses solder or bumps such as copper pillar. This means that the I/O pads can be placed at any section of the surface of the chip and therefore the chip size can be reduced with an appropriate circuitry path. This is attributed to the fact that the absence of a bonding wire contributes to the minimization of signal inductance.

Contact Info:-

High Quality PCB Co., Limited

Office: Shajing Town, Baoan District, Shenzhen, Guangdong 518000, China

Plant 1 address: Building 5-6, Fu Qiao 3rd Industrial Zone, Bao' an, Shenzhen, Guangdong, China

Plant 2 address: Zhuhai, Guangdong, China

Plant 3 address: Dongguan, Guangdong, China

TEL: +86-755-23724206

WahtsApp: +86-189 2381 2997

Skype: shawnwang2006

Email: sales@efpcb.com



Target State: All States
Target City : Shenzhen
Last Update : Sep 30, 2024 7:07 AM
Number of Views: 110
Item  Owner  : Shawn Wang
Contact Email:
Contact Phone: +86-755-23724206

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