CSP substrate (Computers - Hardware)

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Item ID 133216587 in Category: Computers - Hardware

CSP substrate


CSP substrate is one of the IC packaging technologies that is used in the formation of microelectronic systems. The size of the package is up to 1 and it can be a combination of parts of the number or only the first part. Two times the die size of the actual die with a single-die package which has direct surface mounts ability. It was first developed in the 1990s as a result of large requirements for small as well as efficient packages.

Contact Info:-

High Quality PCB Co., Limited

Office: Shajing Town, Baoan District, Shenzhen, Guangdong 518000, China

Plant 1 address: Building 5-6, Fu Qiao 3rd Industrial Zone, Bao' an, Shenzhen, Guangdong, China

Plant 2 address: Zhuhai, Guangdong, China

Plant 3 address: Dongguan, Guangdong, China

TEL: +86-755-23724206

WahtsApp: +86-189 2381 2997

Skype: shawnwang2006

Email: sales@efpcb.com


Related Link: Click here to visit item owner's website (0 hit)

Target State: All States
Target City : Shenzhen
Last Update : Oct 08, 2024 1:37 AM
Number of Views: 130
Item  Owner  : Shawn Wang
Contact Email:
Contact Phone: +86-755-23724206

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2024-10-31 (0.453 sec)