IC Packaging Substrates: The Backbone of Integrated Circuits (Computers - Hardware)

Item ID 133245544 in Category: Computers - Hardware

IC Packaging Substrates: The Backbone of Integrated Circuits
Facilitated Circuit (IC) substrates are the foundation materials used in IC packaging substrates to get and work with relationship between the IC and the followed network on the PCB. These substrates consolidate different layers, a supporting community in the center, an association of drill openings, and guide pads, making them harder to create than standard PCBs. Contact info:- https://efpcb.wordpress.com/2024/10/30/ic-packaging-substrates-the-backbone-of-integrated-circuits/
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Target State: All States Target City : Shenzhen Last Update : Nov 02, 2024 10:51 AM Number of Views: 85	Item Owner : Shawn Wang Contact Email: Contact Phone: +86-755-23724206

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2024-11-17 (0.385 sec)